DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 259

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Figure 8.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three
words from a 16-bit two-state access area to another 16-bit two-state access area.
When the DMAC is activated from a DREQ pin there is a minimum interval of four states from
when the transfer is requested until the DMAC starts operating. The DREQ pin is not sampled
during the time between the transfer request and the start of the transfer. In short address mode and
normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the pin
is next sampled at the end of one block transfer.
Address
bus
RD
HWR,
LWR
CPU cycle
T
1
T
2
T
d
T
1
Source
address
Figure 8.15 Burst DMA Bus Timing
T
2
T
Destination
address
1
T
2
T
DMAC cycle
1
T
2
Rev. 3.00 Mar 21, 2006 page 229 of 814
T
1
T
2
T
1
Section 8 DMA Controller
T
2
T
1
REJ09B0302-0300
T
2
T
CPU cycle
1
T
2

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