DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 687

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.3.8
DMAC timing is shown as follows.
DMAC TEND output timing for 2 state access
Figure 21.24 shows the DMAC TEND output timing for 2 state access.
DMAC TEND output timing for 3 state access
Figure 21.25 shows the DMAC TEND output timing for 3 state access.
DMAC DREQ input timing
Figure 21.26 shows DMAC DREQ input timing.
TEND
DMAC Timing
Figure 21.24 DMAC TEND
Figure 21.25 DMAC TEND
TEND
t
TED1
DREQ
Figure 21.26 DMAC DREQ
T
1
t
TED1
TEND Output Timing for 2 State Access
TEND
TEND
TEND
TEND
TEND Output Timing for 3 State Access
T
1
t
DRQS
T
2
DREQ Input Timing
DREQ
DREQ
t
DRQH
Rev. 3.00 Mar 21, 2006 page 657 of 814
T
2
Section 21 Electrical Characteristics
T
3
t
TED2
REJ09B0302-0300
t
TED2