DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 668

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
Table 21.6 Control Signal Timing
Conditions:
Item
RES setup time
RES pulse width
Mode programming setup time
NMI setup time
(NMI, IRQ
NMI hold time
(NMI, IRQ
Interrupt pulse width
(NMI, IRQ
software standby mode)
Clock oscillator settling time at
reset (crystal)
Clock oscillator settling time in
software standby (crystal)
Rev. 3.00 Mar 21, 2006 page 638 of 814
REJ09B0302-0300
5
5
2
to IRQ
to IRQ
to IRQ
V
V
CC
SS
0
0
0
)
)
= AV
= 5.0 V ±10%, AV
when exiting
SS
= 0 V, = 2 MHz to 25 MHz, T
Symbol
t
t
t
t
t
t
t
t
RESS
RESW
MDS
NMIS
NMIH
NMIW
OSC1
OSC2
CC
= 5.0 V ±10%, V
Min
200
20
200
150
10
200
20
7
Conditions
REF
a
Max
—
—
—
—
—
—
—
—
= –20°C to +75°C
= 4.5 V to AV
Unit
ns
t
ns
ns
ms
ns
cyc
CC
,
Test
Conditions
Figure 21.15
Figure 21.16
Figure 21.18
Figure 20.1