DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 836

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix D Pin States
Reset in T
T
initialized to the input state. AS, RD, HWR, and LWR go high, and the data bus goes to the high-
impedance state. The address bus outputs are held during the T
when a reset occurs in the T
Rev. 3.00 Mar 21, 2006 page 806 of 814
REJ09B0302-0300
3
RES
Internal
reset signal
Address bus
CS
CS
AS
RD (read access)
HWR, LWR
(write access)
Data bus
(write access)
I/O port
state of an external three-state space access cycle. As soon as RES goes low, all ports are
0
7
to CS
3
State: Figure D.3 is a timing diagram for the case in which RES goes low during the
1
Figure D.3 Reset during Memory Access (Reset during T
2
state of an access cycle to a two-state-access area.
Access to external address
T
1
T
2
3
state. The same timing applies
T
3
3
State)
High impedance
High impedance
High impedance
H'000000