DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 150

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 6 Bus Controller
Chip select signals (CS
can be selected in ABWCR, ASTCR, WCER, and WCR as shown in table 6.3.
Table 6.3
ABWCR
ABWn
0
1
Note: n = 7 to 0
Rev. 3.00 Mar 21, 2006 page 120 of 814
REJ09B0302-0300
ASTCR
ASTn
0
1
0
1
Bus Specifications
WCER
WCEn
—
0
1
—
0
1
7
to CS
0
) can be output for areas 7 to 0. The bus specifications for each area
WMS1
—
—
0
1
—
—
0
1
WCR
WMS0
—
—
0
1
0
1
—
—
0
1
0
1
Bus
Width
16
16
16
16
16
16
8
8
8
8
8
8
Access
States
2
3
3
3
3
3
2
3
3
3
3
3
Bus Specifications
Wait Mode
Disabled
Pin wait mode 0
Programmable wait mode
Disabled
Pin wait mode 1
Pin auto-wait mode
Disabled
Pin wait mode 0
Programmable wait mode
Disabled
Pin wait mode 1
Pin auto-wait mode