DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 150

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
Chip select signals (CS
can be selected in ABWCR, ASTCR, WCER, and WCR as shown in table 6.3.
Table 6.3
ABWCR
ABWn
0
1
Note: n = 7 to 0
Rev. 3.00 Mar 21, 2006 page 120 of 814
REJ09B0302-0300
ASTCR
ASTn
0
1
0
1
Bus Specifications
WCER
WCEn
0
1
0
1
7
to CS
0
) can be output for areas 7 to 0. The bus specifications for each area
WMS1
0
1
0
1
WCR
WMS0
0
1
0
1
0
1
0
1
Bus
Width
16
16
16
16
16
16
8
8
8
8
8
8
Access
States
2
3
3
3
3
3
2
3
3
3
3
3
Bus Specifications
Wait Mode
Disabled
Pin wait mode 0
Programmable wait mode
Disabled
Pin wait mode 1
Pin auto-wait mode
Disabled
Pin wait mode 0
Programmable wait mode
Disabled
Pin wait mode 1
Pin auto-wait mode

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