DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 663

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Item
Input
leakage
current
Three-state
leakage
current
(off state)
Input pull-up
current
Input
capacitance
Current
dissipation *
Analog
power
supply
current
2
STBY, NMI,
RES, FWE,
MD
Port 7
Ports 1, 2, 3,
4, 5, 6, 8 to B
Ports 2, 4,
and 5
FWE
NMI
All input pins
except NMI
Normal operation
Sleep mode
Module standby
mode *
Standby mode *
Flash
programming /
erasing
During A/D
conversion
During A/D and
D/A conversion
Idle
2
to MD
4
0
3
Symbol Min
|I
|I
–I
C
I
AI
CC
in
TSI
in
P
CC
|
|
50
Typ
25
35
23
33
18
25
1.0
35
45
0.5
0.5
0.01
Rev. 3.00 Mar 21, 2006 page 633 of 814
Section 21 Electrical Characteristics
Max
1.0
1.0
1.0
300
60
50
15
48
60
38
50
25
40
10
80
58
70
1.5
1.5
5.0
Unit Test Conditions
µA
µA
µA
µA
pF
pF
pF
mA
mA
mA
mA
mA
mA
µA
µA
mA
mA
mA
mA
µA
REJ09B0302-0300
V
V
V
AV
V
V
V
V
f = 1 MHz
T
f = 18 MHz
f = 25 MHz
f = 18 MHz
f = 25 MHz
f = 18 MHz
f = 25 MHz
T
50°C < T
f = 18 MHz
f = 25 MHz
DASTE = 0
a
a
in
CC
in
in
CC
in
IN
= 25°C
CC
= 0.5 to
= 0.5 to
= 0.5 to
= 0 V
= 0 V
– 0.5 V
– 0.5 V
50°C
– 0.5 V
a

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