DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 663

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
Input
leakage
current
Three-state
leakage
current
(off state)
Input pull-up
current
Input
capacitance
Current
dissipation *
Analog
power
supply
current
2
STBY, NMI,
RES, FWE,
MD
Port 7
Ports 1, 2, 3,
4, 5, 6, 8 to B
Ports 2, 4,
and 5
FWE
NMI
All input pins
except NMI
Normal operation
Sleep mode
Module standby
mode *
Standby mode *
Flash
programming /
erasing
During A/D
conversion
During A/D and
D/A conversion
Idle
2
to MD
4
0
3
Symbol Min
|I
|I
–I
C
I
AI
CC
in
TSI
in
P
CC
|
|
—
—
—
50
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
—
—
—
25
35
23
33
18
25
1.0
—
35
45
0.5
0.5
0.01
Rev. 3.00 Mar 21, 2006 page 633 of 814
Section 21 Electrical Characteristics
Max
1.0
1.0
1.0
300
60
50
15
48
60
38
50
25
40
10
80
58
70
1.5
1.5
5.0
Unit Test Conditions
µA
µA
µA
µA
pF
pF
pF
mA
mA
mA
mA
mA
mA
µA
µA
mA
mA
mA
mA
µA
REJ09B0302-0300
V
V
V
AV
V
V
V
V
f = 1 MHz
T
f = 18 MHz
f = 25 MHz
f = 18 MHz
f = 25 MHz
f = 18 MHz
f = 25 MHz
T
50°C < T
f = 18 MHz
f = 25 MHz
DASTE = 0
a
a
in
CC
in
in
CC
in
IN
= 25°C
CC
= 0.5 to
= 0.5 to
= 0.5 to
= 0 V
= 0 V
– 0.5 V
– 0.5 V
50°C
– 0.5 V
a