DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 321

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Pin
PA
TCLKB/
TEND
1
/TP
1
1
/
Pin Functions and Selection Method
DMAC channel 1 settings (bits DTS2/1/0A and DTS2/1/0B in DTCR1A and DTCR1B),
bit NDER1 in NDERA, and bit PA
DMAC
channel 1
settings
PA
NDER1
Pin function
Note: * TCLKB input when MDF = 1 in TMDR, or when TPSC2 = 1, TPSC1 = 0, and
DMAC
channel 1
settings
DTS2A,
DTS1A
DTS0A
DTS2B
DTS1B
1
DDR
TPSC0 = 1 in any of TCR4 to TCR0.
TEND
—
(1) in table
0
below
(2)
—
—
1
Not both 1
output
—
1
0
1
DDR in PADDR select the pin function as follows
(1)
1
1
PA
1
—
0
input
(2)
—
Rev. 3.00 Mar 21, 2006 page 291 of 814
0
0
TCLKB input *
(1)
—
PA
(2) in table
0
1
below
1
output
1
0
Both 1
—
1
0
Section 9 I/O Ports
(2)
REJ09B0302-0300
TP
1
1
0
1
output
1
1
(1)
1
1
1