DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 718

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Appendix B Internal I/O Register
Address
(low)
H'30
H'31
H'32
H'33
H'34
H'35
H'36
H'37
H'38
H'39
H'3A
H'3B
H'3C
H'3D
H'3E
H'3F
H'40
H'41
H'42
H'43
H'44
H'45
H'46
H'47
H'48
H'49
H'4A
H'4B
Rev. 3.00 Mar 21, 2006 page 688 of 814
REJ09B0302-0300
Register
Name
MAR1AR
MAR1AE
MAR1AH
MAR1AL
ETCR1AH
ETCR1AL
IOAR1A
DTCR1A
MAR1BR
MAR1BE
MAR1BH
MAR1BL
ETCR1BH
ETCR1BL
IOAR1B
DTCR1B
FLMCR1
FLMCR2
EBR1
EBR2
Reserved area (access prohibited)
RAMCR
Reserved area (access prohibited)
Data
Bus
Width Bit 7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
DTE
DTE
DTE
DTME
FWE
FLER
EB7
EB15
—
Bit 6
DTSZ
DTSZ
DTSZ
—
SWE1
SWE2
EB6
EB14
—
Bit 5
DTID
SAID
DTID
DAID
ESU1
ESU2
EB5
EB13
—
Bit 4
RPE
SAIDE
RPE
DAIDE
PSU1
PSU2
EB4
EB12
—
Bit Names
Bit 3
DTIE
DTIE
DTIE
TMS
EV1
EV2
EB3
EB11
RAMS
Bit 2
DTS2
DTS2A
DTS2
DTS2B
PV1
PV2
EB2
EB10
RAM2
Bit 1
DTS1
DTS1A
DTS1
DTS1B
E1
E2
EB1
EB9
RAM1
Bit 0
DTS0
DTS0A
DTS0
DTS0B
P1
P2
EB0
EB8
RAM0
Module
Name
DMAC
channel 1A
Short
address
mode
Full
address
mode
DMAC
channel 1B
Short
address
mode
Full
address
mode
Flash
memory