DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 172

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 6 Bus Controller
6.4
6.4.1
A different bus control signal timing applies when dynamic RAM or pseudo-static RAM is
connected to area 3. For details see section 7, Refresh Controller.
6.4.2
ABWCR, ASTCR, and WCER Write Timing: Data written to ABWCR, ASTCR, or WCER
takes effect starting from the next bus cycle. Figure 6.20 shows the timing when an instruction
fetched from area 0 changes area 0 from three-state access to two-state access.
Rev. 3.00 Mar 21, 2006 page 142 of 814
REJ09B0302-0300
Address
bus
Usage Notes
Connection to Dynamic RAM and Pseudo-Static RAM
Register Write Timing
3-state access to area 0
T
1
T
2
Figure 6.20 ASTCR Write Timing
T
3
T
1
ASTCR address
T
2
T
3
2-state access
to area 0
T
1
T
2