DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 172

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
6.4
6.4.1
A different bus control signal timing applies when dynamic RAM or pseudo-static RAM is
connected to area 3. For details see section 7, Refresh Controller.
6.4.2
ABWCR, ASTCR, and WCER Write Timing: Data written to ABWCR, ASTCR, or WCER
takes effect starting from the next bus cycle. Figure 6.20 shows the timing when an instruction
fetched from area 0 changes area 0 from three-state access to two-state access.
Rev. 3.00 Mar 21, 2006 page 142 of 814
REJ09B0302-0300
Address
bus
Usage Notes
Connection to Dynamic RAM and Pseudo-Static RAM
Register Write Timing
3-state access to area 0
T
1
T
2
Figure 6.20 ASTCR Write Timing
T
3
T
1
ASTCR address
T
2
T
3
2-state access
to area 0
T
1
T
2

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