DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 37

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

1.3
1.3.1
Figure 1.2 shows the pin arrangement of the H8/3052BF.
Note: * An external capacitor must be connected to the V
PA /TP /TIOCA /A /CS
PA /TP /TIOCB /A /CS
PA /TP /TIOCA /A /CS
PA /TP /TIOCA /TCLKC
PA /TP /TIOCB /TCLKD
PA /TP /TEND /TCLKA
PA /TP /TEND /TCLKB
4
5
6
2
3
PA /TP /TIOCB /A
1
Pin Arrangement
0
Pin Description
4
5
6
7
2
3
1
0
P8 /RFSH/IRQ
0.1 µF
P8 /CS /IRQ
P8 /CS /IRQ
P8 /CS /IRQ
7
P7 /AN /DA
P7 /AN /DA
0
Figure 1.2 Pin Arrangement (FP-100B or TFP-100B, Top View)
1
2
3
6
7
1
1
2
1
0
P7 /AN
P7 /AN
P7 /AN
P7 /AN
P7 /AN
P7 /AN
1
P8 /CS
0
0
23
22
3
2
1
21
0
1
2
3
4
5
6
7
4
AV
2
V
AV
REF
V
CC
SS
SS
20
0
6
5
4
0
1
2
3
4
5
0
1
0
1
2
3
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
(FP-100B, TFP-100B)
Top view
Rev. 3.00 Mar 21, 2006 page 7 of 814
CL
pin.
Section 1 Overview
REJ09B0302-0300
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
A /P2
A /P2
A /P2
A /P2
A /P2
A /P2
V
A /P1
A /P1
A /P1
A /P1
A /P1
A /P1
A /P1
A /P1
V
D /P3
D /P3
D /P3
D /P3
D /P3
D /P3
D /P3
D /P3
D /P4
12
13
11
10
15
14
13
12
11
10
9
8
SS
7
6
5
4
3
2
1
0
CC
9
8
7
7
6
5
4
3
2
1
0
1
0
1
0
7
5
4
3
2
7
6
5
4
3
2