DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 635

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Notes:
V
FWE
MD
RES
SWE1(2) bit
CC
2
to MD
Flash memory access disabled period
(x: Wait time after SWE1(2) setting)
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
1. Always fix the level by pulling down or pulling up the mode pins (MD
2. See 21.2.5 Flash Memory Characteristics.
0
up to powering off, except for mode switching.
*1
Figure 18.19 Powering On/Off Timing (User Program Mode)
t
OSC1
t
MDS
SWE1 (2)
set
t
H
Wait time: x
*2
Programming and
erase possible
Rev. 3.00 Mar 21, 2006 page 605 of 814
SWE1 (2)
clear
2
REJ09B0302-0300
to MD
Section 18 ROM
Min 0 s
0
)

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