DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 635

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Notes:
V
FWE
MD
RES
SWE1(2) bit
CC
2
to MD
Flash memory access disabled period
(x: Wait time after SWE1(2) setting)
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
1. Always fix the level by pulling down or pulling up the mode pins (MD
2. See 21.2.5 Flash Memory Characteristics.
0
up to powering off, except for mode switching.
*1
Figure 18.19 Powering On/Off Timing (User Program Mode)
t
OSC1
t
MDS
SWE1 (2)
set
t
H
Wait time: x
*2
Programming and
erase possible
Rev. 3.00 Mar 21, 2006 page 605 of 814
SWE1 (2)
clear
2
REJ09B0302-0300
to MD
Section 18 ROM
Min 0 s
0
)