DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 671

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.2.4
Table 21.9 lists the D/A conversion characteristics.
Table 21.9 D/A Converter Characteristics
Conditions:
Item
Resolution
Conversion time
Absolute accuracy
D/A Conversion Characteristics
V
V
CC
SS
= AV
= 5.0 V ±10%, AV
SS
= 0 V, = 2 MHz to 25 MHz, T
Min
8
—
—
—
CC
Conditions
Typ
8
—
±1.5
—
= 5.0 V ±10%, V
Max
8
10
±2.0
±1.5
Rev. 3.00 Mar 21, 2006 page 641 of 814
REF
a
= –20°C to +75°C
Section 21 Electrical Characteristics
= 4.5 V to AV
Unit
Bits
µs
LSB
LSB
Test Conditions
20-pF capacitive load
2-M resistive load
4-M resistive load
CC
,
REJ09B0302-0300