DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 541

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

to enable interrupt requests, when a transmit error occurs and the ERS flag is set to 1, a
transmit/receive-error interrupt (ERI) is requested.
The timing of TEND flag setting depends on the GM bit in SMR. The timing is shown in figure
14.6.
If the TXI interrupt activates the DMAC, the number of bytes designated in the DMAC can be
transmitted automatically, including automatic retransmit.
For details, see Interrupt Operations and Data Transfer by DMAC in this section.
No
No
No
Figure 14.4 Transmit Flowchart (Example)
Write data in TDR and clear
TDRE flag to 0 in SSR
Start transmitting
Clear TE bit to 0
FER/ERS = 0 ?
FER/ERS = 0 ?
transmitted ?
TEND = 1 ?
TEND = 1 ?
Initialize
All data
Start
End
Yes
Yes
Yes
Yes
Yes
No
No
Rev. 3.00 Mar 21, 2006 page 511 of 814
Error handling
Error handling
Section 14 Smart Card Interface
REJ09B0302-0300