DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 685

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
21.3.6
ITU timing is shown as follows:
Output
compare
Input
capture
Notes: 1. TIOCA0 to TIOCA4, TIOCB0 to TIOCB4, TOCXA4, TOCXB4
TCLKA to
TCLKD
ITU input/output timing
Figure 21.20 shows the ITU input/output timing.
ITU external clock input timing
Figure 21.21 shows the ITU external clock input timing.
*2
2. TIOCA0 to TIOCA4, TIOCB0 to TIOCB4
ITU Timing
*1
Figure 21.21 ITU External Clock Input Timing
t
TCKWL
Figure 21.20 ITU Input/Output Timing
t
TOCD
t
TCKS
Rev. 3.00 Mar 21, 2006 page 655 of 814
Section 21 Electrical Characteristics
t
TCKWH
t
TICS
REJ09B0302-0300
t
TCKS

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