DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 516

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 13 Serial Communication Interface
Rev. 3.00 Mar 21, 2006 page 486 of 814
REJ09B0302-0300
Transmitting and Receiving Serial Data Simultaneously (Synchronous Mode)
Figure 13.20 shows a sample flowchart for transmitting and receiving serial data
simultaneously and indicates the procedure to follow.
Serial data
RDRF
ORER
Serial clock
RXI
request
Bit 7
Figure 13.19 Example of SCI Receive Operation
RXI interrupt
handler reads
data in RDR
and clears
RDRF flag to 0
Bit 0
1 frame
Bit 7
RXI
request
Bit 0
Bit 1
Bit 6
Overrun error,
ERI request
Bit 7

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