DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 332

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 9 I/O Ports
Pin
PB
TIOCA
Rev. 3.00 Mar 21, 2006 page 302 of 814
REJ09B0302-0300
0
/TP
3
8
/
Pin Functions and Selection Method
ITU channel 3 settings (bit CMD1 in TFCR, bit EA3 in TOER, bit PWM3 in TMDR, and
bits IOA2 to IOA0 in TIOR3), bit NDER8 in NDERB, and bit PB
the pin function as follows
ITU channel 3
settings
PB
NDER8
Pin function
Note: * TIOCA
ITU channel 3
settings
EA3
CMD1
PWM3
IOA2
IOA1
IOA0
0
DDR
3
input when CMD1 = PWM3 = 0 and IOA2 = 1.
TIOCA
(1) in table
(2)
0
below
3
output
(2)
0
0
0
PB
0
0
1
0
0
input
(1)
0
0
0
1
TIOCA
(2) in table
PB
1
below
0
output
1
0
3
(2)
1
input *
0
DDR in PBDDR select
1
TP
(1)
8
output
1
1
1

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