DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 674

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Electrical Characteristics
Rev. 3.00 Mar 21, 2006 page 644 of 814
REJ09B0302-0300
A
CS
AS
RD
(read)
D
(read)
HWR, LWR
(write)
D
(write)
23
15
15
Basic bus cycle: three-state access with one wait state
Figure 21.6 shows the timing of the external three-state access cycle with one wait state
inserted.
7
to A
to D
to D
to CS
0
0
0
,
0
t
t
t
CH
CF
WDD
Figure 21.4 Basic Bus Cycle: Two-State Access
t
t
t
t
AS1
AS1
AS1
AD
t
T
CYC
1
t
t
t
t
ASD
ASD
ASD
ACC1
t
CL
t
t
ACC3
ACC3
t
cyc
t
WDS1
t
WSW1
t
CR
t
RDS
T
2
t
t
t
SD
SD
SD
t
RDH
t
WDH
t
t
t
AH
AH
AH
t
t
t
PCH
PCH
PCH

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