DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 393

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
In complementary PWM mode, TCNT3 and TCNT4 overshoot and undershoot at the transitions
between up-counting and down-counting. The setting conditions for the IMFA bit in channel 3 and
the OVF bit in channel 4 differ from the usual conditions. In buffered operation the buffer transfer
conditions also differ. Timing diagrams are shown in figures 10.37 and 10.38.
Buffer transfer
signal (BR to GR)
TCNT3
GRA3
IMFA
GR
Figure 10.37 Overshoot Timing
N – 1
Buffer transfer
N
Set to 1
Section 10 16-Bit Integrated Timer Unit (ITU)
N
Rev. 3.00 Mar 21, 2006 page 363 of 814
N + 1
N
Flag not set
No buffer transfer
N – 1
REJ09B0302-0300

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