DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 588

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 18 ROM
State transitions between the normal user mode and on-board programming mode are performed
by changing the FWE pin level from high to low or from low to high. To prevent misoperation
(erroneous programming or erasing) in these cases, the bits in the flash memory control registers
(FLMCR1, FLMCR2) should be cleared to 0 before making such a transition. After the bits are
cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is
insufficient.
Rev. 3.00 Mar 21, 2006 page 558 of 814
REJ09B0302-0300