DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 405

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure 10.53 shows an example in which GRB3 is buffered by BRB3 in complementary PWM
mode. Buffering is used to set GRB3 to a higher value than GRA3, generating a PWM waveform
with 0% duty cycle. The BRB3 value is transferred to GRB3 when TCNT3 matches GRA3, and
when TCNT4 underflows.
Figure 10.53 Register Buffering (Example 3: Buffering in Complementary PWM Mode)
H'1FFF
GRA3
H'0999
H'0000
BRB3
GRB3
TIOCA
TIOCB
TCNT3 and
TCNT4 values
3
3
H'0999
H'0999
H'0999
TCNT3
TCNT4
H'1FFF
H'1FFF
Section 10 16-Bit Integrated Timer Unit (ITU)
Rev. 3.00 Mar 21, 2006 page 375 of 814
H'1FFF
H'0999
H'0999
GRB3
REJ09B0302-0300
Time