DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 497

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Set TE or RE bit to 1 in SCR
Set CKE1 and CKE0 bits
Transmitting or receiving
Set RIE, TIE, TEIE, and
in SCR (leaving TE and
MPIE bits as necessary
Select communication
Clear TE and RE bits
RE bits cleared to 0)
Start of initialization
Set value in BRR
format in SMR
1 bit interval
to 0 in SCR
elapsed?
Yes
Figure 13.4 Sample Flowchart for SCI Initialization
Wait
No
1
2
3
4
1. Select the clock source in SCR. Clear the RIE, TIE,
2. Select the communication format in SMR.
3. Write the value corresponding to the bit rate in BRR.
4. Wait for at least the interval required to transmit or
TEIE, MPIE, TE, and RE bits to 0. If clock output is
selected in asynchronous mode, clock output starts
immediately after the setting is made in SCR.
This step is not necessary when an external clock is
used.
receive 1 bit, then set the TE or RE bit to 1 in SCR.
Set the RIE, TIE, TEIE, and MPIE bits as necessary.
Setting the TE or RE bit enables the SCI to use the
TxD or RxD pin.
Section 13 Serial Communication Interface
Rev. 3.00 Mar 21, 2006 page 467 of 814
REJ09B0302-0300

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