DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 198

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 7 Refresh Controller
Example 3: Connection to 2CAS
interconnections to a single 2CAS 4-Mbit DRAM, and the corresponding address map.
Figure 7.12 shows a setup procedure to be followed by a program for this example.
The DRAM in this example has 9-bit row addresses and 9-bit column addresses. Its address area is
H'600000 to H'67FFFF.
Rev. 3.00 Mar 21, 2006 page 168 of 814
REJ09B0302-0300
Figure 7.11 Interconnections and Address Map for 2CAS
H8/3052BF
H'600000
H'67FFFF
H'680000
H'7FFFFF
D
15
to D
CAS
CAS
CAS 4-Mbit DRAM (16-Mbyte Mode): Figure 7.11 shows typical
HWR
LWR
CS
RD
A
A
A
A
A
A
A
A
A
9
8
7
6
5
4
3
2
1
3
0
DRAM area
Not used
a. Interconnections (example)
b. Address map
Area 3 (16-Mbyte mode)
CAS
CAS 4-Mbit DRAM (Example)
CAS
2
row address, 9-bit column address,
and
CAS
A
A
A
A
A
A
A
A
A
RAS
UCAS
LCAS
WE
OE
I/O
8
7
6
5
4
3
2
1
0
15
16-bit organization
4-Mbit DRAM with 9-bit
to I/O
0