DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 174

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 6 Bus Controller
6.4.3
After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high
level before BACK goes low, the bus arbiter may operate incorrectly.
To terminate the external-bus-released state, hold the BREQ signal high for at least three states. If
BREQ is high for too short an interval, the bus arbiter may operate incorrectly.
6.4.4
If contention occurs between a transition to software standby mode and a bus request from an
external bus master, the bus may be released for one state just before the transition to software
standby mode (see figure 6.23). When using software standby mode, clear the BRLE bit to 0 in
BRCR before executing the SLEEP instruction.
Rev. 3.00 Mar 21, 2006 page 144 of 814
REJ09B0302-0300
BREQ
BACK
Address bus
Strobe
Figure 6.23 Contention between Bus-Released State and Software Standby Mode
BREQ Input Timing
BREQ
Transition to Software Standby Mode
BREQ
BREQ
Bus-released state
Software standby mode