DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 331

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Pin
PB
TIOCB
1
/TP
3
9
/
Pin Functions and Selection Method
ITU channel 3 settings (bit PWM3 in TMDR, bit CMD1 in TFCR, bit EB3 in TOER, and
bits IOB2 to IOB0 in TIOR3), bit NDER9 in NDERB, and bit PB
the pin function as follows
ITU channel 3
settings
PB
NDER9
Pin function
Note: * TIOCB
ITU channel 3
settings
EB3
CMD1
IOB2
IOB1
IOB0
1
DDR
3
input when CMD1 = PWM3 = 0 and IOB2 = 1.
TIOCB
(1) in table
(2)
0
below
3
output
(2)
0
0
0
PB
1
0
input
Rev. 3.00 Mar 21, 2006 page 301 of 814
0
0
1
(1)
0
TIOCB
(2) in table
PB
1
0
1
below
1
output
1
0
3
input *
1
DDR in PBDDR select
Section 9 I/O Ports
REJ09B0302-0300
(2)
1
TP
9
output
1
1
(1)
1

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