DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 686

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Electrical Characteristics
21.3.7
SCI timing is shown as follows:
Rev. 3.00 Mar 21, 2006 page 656 of 814
REJ09B0302-0300
SCK0, SCK1
TxD0, TxD1
(transmit
data)
RxD0, RxD1
(receive
data)
SCI input clock timing
Figure 21.22 shows the SCK input clock timing.
SCI input/output timing (synchronous mode)
Figure 21.23 shows the SCI input/output timing in synchronous mode.
SCK0, SCK1
SCI Input/Output Timing
Figure 21.23 SCI Input/Output Timing in Synchronous Mode
t
TXD
Figure 21.22 SCK Input Clock Timing
t
Scyc
t
SCKW
t
RXS
t
RXH
t
Scyc
t
SCKr
t
SCKf

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