DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 59

MCU 5V 512K 100-TQFP

DF3052BX25V

Manufacturer Part Number
DF3052BX25V
Description
MCU 5V 512K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3052BX25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3052BX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
2.5.2
Figure 2.7 shows the data formats on memory. The H8/300H CPU can access word data and
longword data on memory, but word or longword data must begin at an even address. If an attempt
is made to access word or longword data at an odd address, no address error occurs but the least
significant bit of the address is regarded as 0, so the access starts at the preceding address. This
also applies to instruction fetches.
When ER7 (SP) is used as an address register to access the stack, the operand size should be word
size or longword size.
Memory Data Formats
Data Type
1-bit data
Byte data
Word data
Longword data
Figure 2.7 Memory Data Formats
Address
Address L
Address L
Address 2M
Address 2M + 1
Address 2N
Address 2N + 1
Address 2N + 2
Address 2N + 3
MSB
MSB
MSB
7
7
6
Rev. 3.00 Mar 21, 2006 page 29 of 814
Data Format
5
4
3
2
1
REJ09B0302-0300
LSB
LSB
LSB
Section 2 CPU
0
0

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