DF3052BX25V Renesas Electronics America, DF3052BX25V Datasheet - Page 643

• Manufacturer Part Number: DF3052BX25V
• Description: MCU 5V 512K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3052BX25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

19.3
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate the signal that becomes the system clock.
19.4
The prescalers divide the system clock ( ) to generate internal clocks ( /2 to /4096).
19.5
The frequency divider divides the duty-adjusted clock signal to generate the system clock ( ). The
frequency division ratio can be changed dynamically by modifying the value in DIVCR, as
described below. Power consumption in the chip is reduced in almost direct proportion to the
frequency division ratio. The system clock generated by the frequency divider can be output at the
pin.
V
STBY
EXTAL
external)
RES
Note: * t
CC
(internal or
Prescalers
Duty Adjustment Circuit
Frequency Divider
2.7 V
DEXT
V
IH
includes 10 t
Figure 19.7 External Clock Output Settling Delay Timing
cyc
of RES pulse width (t
t
DEXT
*
RESW
Rev. 3.00 Mar 21, 2006 page 613 of 814
).
Section 19 Clock Pulse Generator
REJ09B0302-0300