MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet - Page 1176
MCIMX286CVM4B
Manufacturer Part Number
MCIMX286CVM4B
Description
IC MPU I.MX286 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r
Datasheets
1.MCIMX283DVM4B.pdf
(70 pages)
2.MCIMX283DVM4B.pdf
(2 pages)
3.MCIMX283DVM4B.pdf
(2327 pages)
4.MCIMX283DVM4B.pdf
(20 pages)
Specifications of MCIMX286CVM4B
Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
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Programmable Registers
1176
ODT_RD_MAP_
ODT_RD_MAP_
ODT_RD_MAP_
RSVD3
RSVD2
RSVD1
23 20
19 16
15 12
11 8
Field
CS2
CS1
CS0
7 4
3 0
Bit [3] = CS3 will have active ODT termination when chip select X is performing a read.
Bit [2] = CS2 will have active ODT termination when chip select X is performing a read.
Bit [1] = CS1 will have active ODT termination when chip select X is performing a read.
Bit [0] = CS0 will have active ODT termination when chip select X is performing a read.
Etc.
Always write zeroes to this field.
Determines which chip(s) will have termination when a read occurs on chip 2.
Sets up which (if any) chip(s) will have their ODT termination active while a read occurs on chip select X.
EMI will define this parameter at default for internal testing. The user is required is to change this setting to
meet system specifications.
Example: If the system consists of 4 chip selects and odt_rd_map_cs0 is set to 'b0010, then when CS0 is
performing a read, CS1 will have active ODT termination. And if odt_rd_map_cs0 was set to 'b1000, then
instead CS3 would be active.
Bit [3] = CS3 will have active ODT termination when chip select X is performing a read.
Bit [2] = CS2 will have active ODT termination when chip select X is performing a read.
Bit [1] = CS1 will have active ODT termination when chip select X is performing a read.
Bit [0] = CS0 will have active ODT termination when chip select X is performing a read.
Etc.
Always write zeroes to this field.
Determines which chip(s) will have termination when a read occurs on chip 1.
Sets up which (if any) chip(s) will have their ODT termination active while a read occurs on chip select X.
EMI will define this parameter at default for internal testing. The user is required is to change this setting to
meet system specifications.
Example: If the system consists of 4 chip selects and odt_rd_map_cs0 is set to 'b0010, then when CS0 is
performing a read, CS1 will have active ODT termination. And if odt_rd_map_cs0 was set to 'b1000, then
instead CS3 would be active.
Bit [3] = CS3 will have active ODT termination when chip select X is performing a read.
Bit [2] = CS2 will have active ODT termination when chip select X is performing a read.
Bit [1] = CS1 will have active ODT termination when chip select X is performing a read.
Bit [0] = CS0 will have active ODT termination when chip select X is performing a read.
Etc.
Always write zeroes to this field.
Determines which chip(s) will have termination when a read occurs on chip 0.
Sets up which (if any) chip(s) will have their ODT termination active while a read occurs on chip select X.
EMI will define this parameter at default for internal testing. The user is required is to change this setting to
meet system specifications.
i.MX28 Applications Processor Reference Manual, Rev. 1, 2010
HW_DRAM_CTL83 field descriptions (continued)
Description
Freescale Semiconductor, Inc.
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