MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet - Page 979

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MCIMX286CVM4B

Manufacturer Part Number
MCIMX286CVM4B
Description
IC MPU I.MX286 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r

Specifications of MCIMX286CVM4B

Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
12.11.4 eSD Fast Boot Media Format
The ROM supports eSD by following the same flow as SD 2.0, except that ROM selects
the physical partition 1(boot code area) by sending CMD43. The CMD43 is reserved
command in SD2.0. Therefore, for eSD boot mode, boot image has to be located in partition
1.
If eSD fast boot mode is enabled, the FAST_BOOT bit in the argument of ACMD41 is set.
The eSD device partition 1 should be defined as a fast boot physical partition. Otherwise,
the device still initializes the entire media and not a partial initialization.
The ROM expects the BCB data structure to be present on the first block of boot partition.
Like the BCB and MBR media formats, the ROM uses the persistent bit
ROM_REDUNDANT_BOOT to decide whether to load primary or secondary boot firmware.
12.11.5 Device Identification
SD/MMC boot mode uses the identification processes specified as follows:
12.12 NAND Boot Mode
NAND boot mode is used to boot from both raw NAND devices and block abstracted ONFi
BA NAND devices, with error correction capability in the controller.
12.12.1 Raw NAND Device Boot
The ROM relies on the BCH hardware engine for handling error corrections when reading
data from a raw NAND device.
The boot ROM expects the NAND Flash to be partitioned into the following areas:
The rest of NAND Flash is available for non-boot purposes. FCB and DBBT together are
referred to as boot control blocks, or BCB.
Freescale Semiconductor, Inc.
• SD Specifications, Part 1, Physical Layer Specifications, Version 2.0 Draft.
• SD Specifications, Part 1, eSD (Embedded SD) Specification Version 2.10 Draft Rev.
• MultiMediaCard System Specification Version 4.2, Version 4.3, Version 4.4.
• Search Area for Firmware Configuration Block (FCB)
• Search Area for Discovered Bad Block Table (DBBT)
• Firmware blocks with primary and secondary boot firmware
0.91.
i.MX28 Applications Processor Reference Manual, Rev. 1, 2010
Chapter 12 Boot Modes
979

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