MPC8536E-ANDROID Freescale Semiconductor, MPC8536E-ANDROID Datasheet - Page 1695
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MPC8536E-ANDROID
Manufacturer Part Number
MPC8536E-ANDROID
Description
HARDWARE/SOFTWARE ANDROID OS
Manufacturer
Freescale Semiconductor
Series
PowerQUICC ™r
Type
MPUr
Datasheets
1.MPC8536EBVTAVLA.pdf
(127 pages)
2.MPC8536EBVTAVLA.pdf
(2 pages)
3.MPC8536EBVTAVLA.pdf
(1706 pages)
Specifications of MPC8536E-ANDROID
Contents
Board
For Use With/related Products
MPC8536
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Index
LA[27:31] (LBC non-multiplexed address) signals, 13-7
LAD[0:31] (LBC multiplexed address/data) signals, 13-7
LALE (LBC external address latch enable) signal, 13-5,
LBCTL (LBC data buffer control) signal, 13-7, 13-46
LBS[0:3] (LBC UPM byte select) signals, 13-6
LCK[0:2] (LBC clock) signals, 13-8
LCS[0:7] (LBC chip select) signals, 13-6
LCS[5:7] signal select
LCS0 (LBC chip select 0) signal, 13-58, 13-72
LDP[0:3] (LBC data parity) signals, 13-8
LGPL0 (LBC GP line 0) signal, 13-6
LGPL1 (LBC GP line 1) signal, 13-6
LGPL2 (LBC GP line 2) signal, 13-6
LGPL3 (LBC GP line 3) signal, 13-6
LGPL4 (LBC GP line 4) signal, 13-7
LGPL5 (LBC GP line 5) signal, 13-7
LGTA (LBC GPCM transfer acknowledge) signal, 13-7,
Little-endian, 21-6
Local access windows, 2-3–2-10
Local address map, 1-4
Local bus controller (LBC)
Freescale Semiconductor
timing, 6-27
global utilities, 23-14
ATMUs, see Address translation and mapping units
configuring local access windows, 2-8
distinguishing local access windows from other mapping
illegal interactions
L2 cache/SRAM window interactions, 2-4
precedence if overlapping among themselves, 2-8
precedence if overlapping with L2 cache/SRAM windows,
registers, 2-7–2-8
see also Local access windows, 1-4
address and address space checking, 13-43
address mask field—option registers, 13-13
atomic bus operations, 13-46
block diagram, 13-1
boot chip-select operation, 13-58, 13-72
bus monitor, 13-47
bus turnaround, 13-92
13-43
13-57
between inbound ATMUs and local access windows,
between local access windows and DDR SDRAM chip
by acronym, see Register Index
additional address phases (UPM cycles), 13-93
address following read, 13-93
read data following address, 13-93
(ATMUs)
functions, 2-9
2-4
2-10
selects, 2-9
MPC8536E PowerQUICC III Integrated Processor Reference Manual, Rev. 1
clocks and clock ratios, 13-4
configuration
debug mode
error handling
external access termination (LGTA), 13-57
features, 13-2
functional description, 13-42
general-purpose chip-select machine (GPCM), 13-48
initialization/application information, 13-90
interrupts
LCS[5:7] signal select, 23-14
memory map/register definition, 13-9
memory refresh timer prescaler, 13-23
modes of operation, 13-3
overview, 13-2
performance monitor events, 24-26
peripherals, 13-90
port sizes, 13-93
register descriptions, 13-10
signals, 13-4
UPM interfaces, 13-74–13-104
read-modify-write cycle (parity), 13-93
clock ratio register (LCRR), 13-34
LBC configuration register (LBCR), 13-32
signal selection (POR), 4-23
source and target ID, 25-4, 25-24
transfer error registers, 13-26–13-31
chip-select and write enable negation timing, 13-53
chip-select assertion timing, 13-52
extended hold time on read accesses, 13-56
GPCM mode
output enable timing, 13-56
programmable wait state configuration, 13-53
relaxed timing, 13-54
timing configuration, 13-49, 13-51, 13-68
transfer error interrupt enable register (LTEIR), 13-29
bus clock and clock ratios, 13-4
GPCM mode, registers, 13-14, 13-16
source ID debug mode, 13-4
UPM mode, registers, 13-19
GPCM timing, 13-92
hierarchy for very high speeds, 13-91
multiplexed address/data, 13-90
by acronym, see Register Index
see also Signals, LBC
block diagram, 13-75
extended hold time (reads), 13-90
programming the UPMs, 13-78
RAM array, 13-80
registers, 13-14, 13-16
address multiplexing, 13-86
byte select signal timing, 13-84
Index-9
L–L
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