MPC8313ZQADDC Freescale Semiconductor, MPC8313ZQADDC Datasheet - Page 450

• Manufacturer Part Number: MPC8313ZQADDC
• Description: Microprocessors - MPU 8313 REV2.2 PB NO ENC
• Manufacturer: Freescale Semiconductor

Specifications of MPC8313ZQADDC

• Processor Series: MPC8313
• Core: e300
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 133 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 16 KB
• Interface Type: I2C
• Mounting Style: SMD/SMT
• Package / Case: PBGA
• Number Of Programmable I/os: 32
• Number Of Timers: 4

Enhanced Local Bus Controller
10.1.1
The main component of the eLBC is its memory controller, which provides a seamless interface to many
types of memory devices and peripherals. The memory controller is responsible for controlling four
memory banks shared by a GPCM, an FCM, and up to three UPMs. As such, it supports a minimal glue
logic interface to SRAM, EPROM, NOR Flash EEPROM, NAND Flash EEPROM, burstable RAM,
regular DRAM devices, extended data output DRAM devices, and other peripherals. The external address
latch signal (LALE) allows multiplexing of addresses with data signals to reduce the device pin count.The
eLBC also includes a number of data checking and protection features such as write protection and a bus
monitor to ensure that each bus cycle is terminated within a user-specified period.
10.1.2
The eLBC main features are as follows:
10-2
•
•
•
Memory controller with four memory banks
— 32-bit address decoding with mask
— Variable memory block sizes (32 Kbytes to 4 Gbytes in FCM mode, 32 Kbytes to 64 Mbytes
— Selection of control signal generation on a per-bank basis
— Data buffer controls activated on a per-bank basis
— Automatic segmentation of large transactions into memory accesses optimized for bus width
— Write-protection capability
— Atomic operation
General-purpose chip-select machine (GPCM)
— Compatible with SRAM, EPROM, NOR Flash EEPROM, and peripherals
— Global (boot) chip-select available at system reset
— Boot chip-select support for 8- and 16-bit devices
— Minimum three-clock access to external devices
— Two byte-write-enable signals (LWE[0:1])
— Output enable signal (LOE)
— External access termination signal (LGTA)
NAND Flash control machine (FCM)
— Compatible with small (512+16 bytes) and large (2048+64 bytes) page parallel NAND Flash
— Global (boot) chip-select available at system reset, with 4-Kbyte boot block buffer for
— Read-only ECC registers to verify after write operation
— Boot chip-select support for 8-bit devices
— Dual 2-Kbyte/eight 512-byte buffers allow simultaneous data transfer during flash reads and
in GPCM and UPM modes)
and addressing capability
EEPROM
execute-in-place boot loading
programming
Overview
Features
MPC8313E PowerQUICC™ II Pro Integrated Processor Family Reference Manual, Rev. 2
Freescale Semiconductor