MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 118

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

MPC555
USER’S MANUAL
SGPIOC[7]/IRQOUT/LWP[0]
/
WE[0:3]/BE[0:3]/AT[0:3]
MPC556
SGPIOC[6]/FRZ/PTR/
IWP[0:1]/VFLS[0:1]
RSTCONF/TEXP
BG/VF[0]/LWP[1]
ENGCLK/BUCLK
BR/VF[1]/IWP[2]
BB/VF[2]/IWP[3]
TDO/DSDO
TCK/DSCK
PORESET
TDI/DSDI
VDDSYN
HRESET
CLKOUT
VSSSYN
SRESET
EXTCLK
RD/ WR
Pin List
BURST
CS[0:3]
BI/STS
EXTAL
TRST
Table 2-6 Pin Names and Abbreviations (Continued)
XTAL
BDIP
TMS
XFC
TEA
OE
TS
TA
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
SIGNAL DESCRIPTIONS
Rev. 15 October 2000
rd_wr_b
burst_b
bdip_b
ts_b
ta_b
tea_b
rstconf_b_texp
oe_b
bi_b_sts_b
cs0_b
cs1_b
cs2_b
cs3_b
we0_b_be0_b_at0
we1_b_be1_b_at1
we2_b_be2_b_at2
we3_b_be3_b_at3
poreset_b
hreset_b
sreset_b
sgpioc6_frz_ptr_b
sgpioc7_irqout_b_lwp0
bg_b_vf0_lwp1
br_b_vf1_iwp2
iwp0_vfls0
iwp1_vfls1
tms
tdi_dsdi
tck_dsck
tdo_dsdo
trst_b
xtal
extal
xfc
clkout
extclk
vddsyn
vsssyn
engclk_buclk
bb_b_vf2_iwp3
Pin Name
rd_wrb
tck_dsck
burstb
bdipb
tsb
tab
teab
rcfb_txp
oeb
bib_stsb
cs0b
cs1b
cs2b
cs3b
web_at[0]
web_at[1]
web_at[2]
web_at[3]
poresetb
hresetb
sresetb
sgp_frz
sgp_irqoutb
bgb_lwp1
brb_iwp2
bbb_iwp3
iwp0_vfls
iwp1_vfls
tms
tdi_dsdi
tdo_dsdo
trst_b
xtal
extal
xfc
clkout
extclk
vddsyn
vsssyn
eck_buck
Abbreviation
R1
V1
U4
U3
U2
T2
U17
T1
V2
P4
R4
R3
R2
N1
P1
P2
P3
V19
W20
V20
K3
M4
N3
N2
N4
L2
L1
K1
K2
J1
J2
J3
U20
T20
R19
V18
U18
R20
T19
U19
MOTOROLA
Ball
2-60