MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 882

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

MPC555 / MPC556
USER’S MANUAL
An estimation of the chip junction temperature, T
equation:
where:
The junction to ambient thermal resistance is an industry standard value which pro-
vides a quick and easy estimation of thermal performance. Unfortunately, the answer
is only an estimate; test cases have demonstrated that errors of a factor of two are pos-
sible. As a result, more detailed thermal characterization is supplied.
Historically, the thermal resistance has frequently been expressed as the sum of a
junction to case thermal resistance and a case to ambient thermal resistance:
where:
R
thermal environment to change the case to ambient thermal resistance, R
stance, the user can change the air flow around the device, add a heat sink, change
the mounting arrangement on printed circuit board, or change the thermal dissipation
on the printed circuit board surrounding the device. This description is most useful for
ceramic packages with heat sinks where some 90% of the heat flow is through the
case to the heat sink to ambient. For most packages, a better model is required.
The simplest thermal model of a package which has demonstrated reasonable accu-
racy (about 20%) is a two resistor model consisting of a junction to board and a junc-
tion to case thermal resistance. The junction to case covers the situation where a heat
sink will be used or where a substantial amount of heat is dissipated from the top of
the package. The junction to board thermal resistance describes the thermal perfor-
mance when most of the heat is conducted to the printed circuit board. It has been ob-
served that the thermal performance of most plastic packages and especially PBGA
packages is strongly dependent on the board. temperature.
If the board temperature is known, an estimate of the junction temperature in the en-
vironment can be made using the following equation:
θJC
T
R
P
R
R
R
is device related and cannot be influenced by the user. The user controls the
A
D
θJA
θJA
θJC
θJA
= ambient temperature (°C)
= power dissipation in package
= package junction to ambient resistance (°C/W)
= junction to ambient thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
= junction to case thermal resistance (°C/W)
Freescale Semiconductor, Inc.
For More Information On This Product,
ELECTRICAL CHARACTERISTICS
Go to: www.freescale.com
Rev. 15 October 2000
T
R
J
θJA
= T
= R
A
+ (R
θJC
θJA
+ R
x P
J
θCA
, in °C can be obtained from the
D
)
θCA
MOTOROLA
. For in-
G-4