MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 463

IC MCU 32BIT 40MHZ 272-BGA

MPC555LFMZP40

Manufacturer Part Number
MPC555LFMZP40
Description
IC MCU 32BIT 40MHZ 272-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC555LFMZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
101
Program Memory Size
448KB (448K x 8)
Program Memory Type
FLASH
Ram Size
26K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
272-PBGA
Controller Family/series
POWER 5xx
Ram Memory Size
26KB
Cpu Speed
63MIPS
Embedded Interface Type
QSPI, SCI, TouCAN
Operating Temperature Range
-40°C To +125°C
No. Of Pins
272
Rohs Compliant
No
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
26 KB
Interface Type
CAN, QSPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
101
Operating Supply Voltage
3.3 V to 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPC555CMEE
Minimum Operating Temperature
- 85 C
On-chip Adc
10 bit, 32 Channel
Cpu Family
MPC55xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
40MHz
Total Internal Ram Size
32KB
# I/os (max)
101
Operating Supply Voltage (typ)
5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
272
Package Type
BGA
For Use With
MPC555CMEE - KIT EVAL FOR MPC555
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC555LFMZP40
Manufacturer:
MOTOLOLA
Quantity:
853
Part Number:
MPC555LFMZP40
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC555LFMZP40
Manufacturer:
MOT
Quantity:
2
Part Number:
MPC555LFMZP40R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
14.1 Overview
14.2 Block Diagram
MPC555 / MPC556
USER’S MANUAL
The queued serial multi-channel module (QSMCM) provides three serial communica-
tion interfaces: the queued serial peripheral interface (QSPI) and two serial communi-
cations interfaces (SCI1 and SCI2). These submodules communicate with the CPU
via a common slave bus interface unit (SBIU).
The QSPI is a full-duplex, synchronous serial interface for communicating with periph-
erals and other MCUs. It is enhanced from the original SPI in the QSMCM (queued
serial module) to include a total of 160 bytes of queue RAM to accommodate more re-
ceive, transmit, and control information. The QSPI is fully compatible with the SPI sys-
tems found on other Motorola devices.
The dual, independent SCIs are used to communicate with external devices and other
MCUs via an asynchronous serial bus. Each SCI is a full-duplex universal asynchro-
nous receiver transmitter (UART) serial interface. The original QSMCM SCI is en-
hanced by the addition of an SCI and a common external baud clock source.
The SCI1 has the ability to use the resultant baud clock from SCI2 as the input clock
source for the SCI1 baud rate generator. Also, the SCI1 has an additional mode of op-
eration that allows queuing of transmit and receive data frames. If the queue feature
is enabled, a set of 16 entry queues is allocated for the receive and/or transmit oper-
ation.
Figure 14-1
QUEUED SERIAL MULTI-CHANNEL MODULE
depicts the major components of the QSMCM.
Freescale Semiconductor, Inc.
QUEUED SERIAL MULTI-CHANNEL MODULE
For More Information On This Product,
Go to: www.freescale.com
Rev. 15 October 2000
SECTION 14
MOTOROLA
14-1

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