MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 794

IC MCU 32BIT 40MHZ 272-BGA

MPC555LFMZP40

Manufacturer Part Number
MPC555LFMZP40
Description
IC MCU 32BIT 40MHZ 272-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC555LFMZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
101
Program Memory Size
448KB (448K x 8)
Program Memory Type
FLASH
Ram Size
26K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
272-PBGA
Controller Family/series
POWER 5xx
Ram Memory Size
26KB
Cpu Speed
63MIPS
Embedded Interface Type
QSPI, SCI, TouCAN
Operating Temperature Range
-40°C To +125°C
No. Of Pins
272
Rohs Compliant
No
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
26 KB
Interface Type
CAN, QSPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
101
Operating Supply Voltage
3.3 V to 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPC555CMEE
Minimum Operating Temperature
- 85 C
On-chip Adc
10 bit, 32 Channel
Cpu Family
MPC55xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
40MHz
Total Internal Ram Size
32KB
# I/os (max)
101
Operating Supply Voltage (typ)
5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
272
Package Type
BGA
For Use With
MPC555CMEE - KIT EVAL FOR MPC555
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

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MPC555 / MPC556
USER’S MANUAL
0x30 606E
MDASM14 (MIOS Double Action Submodule 14)
0x30 6070
0x30 6072
0x30 6074
0x30 6076
MDASM15 (MIOS Double Action Submodule 15)
0x30 6078
0x30 607A
0x30 607C
0x30 607E
MPWMSM16 (MIOS Pulse Width Modulation Submodule 16)
0x30 6080
0x30 6082
0x30 6084
0x30 6086
MPWMSM17 (MIOS Pulse Width Modulation Submodule 17)
0x30 6088
0x30 608A
0x30 608C
0x30 608E
Address
Table A-10 MIOS1 (Modular Input/Output Subsystem) (Continued)
Access
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
S/U
MDASMSCR
MDASMAR
MDASMBR
MDASMSCRD
MDASMSCR
MDASMAR
MDASMBR
MDASMSCRD
MDASMSCR
MPWMSMPERR
MPWMSMPULR
MPWMSMCNTR
MPWMSMSCR
MPWMSMPERR
MPWMSMPULR
MPWMSMCNTR
MPWMSMSCR
Freescale Semiconductor, Inc.
MPC555 / MPC556 INTERNAL MEMORY MAP
For More Information On This Product,
Symbol
Go to: www.freescale.com
Rev. 15 October 2000
MDASM13 Status/Control Register.
See
MDASM14 Data A Register.
See
bit descriptions.
MDASM14 Data B Register.
See
(MDASMBR)
MDASM14 Status/Control Register Duplicat-
ed.
See
ister (Duplicated)
MDASM14 Status/Control Register.
See
MDASM15 Data A Register.
See
bit descriptions.
MDASM15 Data B Register.
See
(MDASMBR)
MDASM15 Status/Control Register Duplicat-
ed.
See
ister (Duplicated)
MDASM15 Status/Control Register.
See
MPWMSM16 Period Register.
See
MPWMSM16 Pulse Register.
See
MPWMSM16 Count Register.
See
MPWMSM16 Status/Control Register.
See
MPWMSM17 Period Register.
See
MPWMSM17 Pulse Register.
See
MPWMSM17 Count Register.
See
MPWMSM17 Status/Control Register.
See
Table 15-17
15.11.1.1 MDASM Data A Register
15.11.1.2 MDASM Data B Register
15.11.1.3 MDASM Status/Control Reg-
Table 15-17
15.11.1.1 MDASM Data A Register
15.11.1.2 MDASM Data B Register
15.11.1.3 MDASM Status/Control Reg-
Table 15-17
Table 15-20
Table 15-21
Table 15-22
Table 15-23
Table 15-20
Table 15-21
Table 15-22
Table 15-23
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
Register
for bit descriptions.
for bit descriptions.
for
for
Size
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
MOTOROLA
Reset
S
X
X
S
S
X
X
S
S
X
X
X
S
X
X
X
S
A-18

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