MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 883

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

G.5.1 Thermal References:
MPC555 / MPC556
USER’S MANUAL
where:
If the board temperature is known and the heat loss from the package case to the air
can be ignored, acceptable predictions of junction temperature can be made. For this
method to work, the board and board mounting must be similar to the test board used
to determine the junction to board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
When the board temperature is not known, a thermal simulation of the application is
needed. The simple two resistor model can be used with the thermal simulation of the
application [2], or a more accurate and complex model of the package can be used in
the thermal simulation. Consultation on the creation of the complex model is available.
To determine the junction temperature of the device in the application after prototypes
are available, the thermal characterization parameter (Ψ
the junction temperature with a measurement of the temperature at the top center of
the package case using the following equation:
where:
The thermal characterization parameter is measured per JESD51-2 characteristic
published by JEDEC using a 40 gauge type T thermocouple epoxied to the top center
of the package case. The thermocouple should be positioned so that the thermocouple
junction rests on the package. A small amount of epoxy is placed over the thermocou-
ple junction and over about 1 mm of wire extending from the junction. The thermocou-
ple wire is placed flat against the package case to avoid measurement errors caused
by cooling effects of the thermocouple wire.
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
[phone]
T
R
P
T
R
P
B
T
D
D
θJB
θJA
= board temperature (°C)
= thermocouple temperature on top of package (°C)
= power dissipation in package (W)
= power dissipation in package
= package junction to board resistance (°C/W)
= thermal characterization parameter
Freescale Semiconductor, Inc.
For More Information On This Product,
ELECTRICAL CHARACTERISTICS
Go to: www.freescale.com
Rev. 15 October 2000
T
T
J
J
= T
= T
B
T
+ (R
+ (Ψ
θJB
JA
x P
x P
D
D
)
)
JT
) can be used to determine
MOTOROLA
G-5