MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 86

IC MCU 32BIT 40MHZ 272-BGA

MPC555LFMZP40

Manufacturer Part Number
MPC555LFMZP40
Description
IC MCU 32BIT 40MHZ 272-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC555LFMZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
101
Program Memory Size
448KB (448K x 8)
Program Memory Type
FLASH
Ram Size
26K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
272-PBGA
Controller Family/series
POWER 5xx
Ram Memory Size
26KB
Cpu Speed
63MIPS
Embedded Interface Type
QSPI, SCI, TouCAN
Operating Temperature Range
-40°C To +125°C
No. Of Pins
272
Rohs Compliant
No
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
26 KB
Interface Type
CAN, QSPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
101
Operating Supply Voltage
3.3 V to 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPC555CMEE
Minimum Operating Temperature
- 85 C
On-chip Adc
10 bit, 32 Channel
Cpu Family
MPC55xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
40MHz
Total Internal Ram Size
32KB
# I/os (max)
101
Operating Supply Voltage (typ)
5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
272
Package Type
BGA
For Use With
MPC555CMEE - KIT EVAL FOR MPC555
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC555LFMZP40
Manufacturer:
MOTOLOLA
Quantity:
853
Part Number:
MPC555LFMZP40
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC555LFMZP40
Manufacturer:
MOT
Quantity:
2
Part Number:
MPC555LFMZP40R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
2.3.8.3 VDDI
2.3.8.4 VSSI
2.3.8.5 KAPWR
2.3.8.6 VDDSRAM
2.3.8.7 VSS
2.4 Reset State
2.4.1 Pin Functionality Out of Reset
MPC555
USER’S MANUAL
Pin Name: vddi
VDDI – 3-V voltage supply input for internal logic.
Pin Name: vssi
VSSI – Zero supply input for internal logic. In packaged devices, VSSI is not a sepa-
rate input from VSS.
Pin Name: kapwr
Keep-Alive Power – 3-V voltage supply input for the oscillator and keep-alive regis-
ters.
Pin Name: vddsram
SRAM Keep-Alive Power – 3-V voltage supply input for the SRAM.
Pin Name: vss
VSS – Ground level reference input.
All input pins, with the exception of the power supply and clock related pins, are “weak-
ly pulled” to a value during reset by a 130-microampere resistor based on certain con-
ditions. In reset state all I/O pins become inputs, and all outputs except clkout,
hreset_b, sreset_b, will be pulled only by the pull-up/pull-down.
The functionality out of reset of some pins that support multiple functionality is defined
in the SIUMCR through the reset configuration word. For details on which multiplexed
pins are configured by the reset configuration word and how they are configured, refer
to
The 3-V related pins have selectable output buffer drive strengths which are controlled
by the COM[0] bit in the USIU’s system clock and reset control register (SCCR). The
control is as follows:
7.5.2 Hard Reset Configuration
/
MPC556
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
SIGNAL DESCRIPTIONS
Rev. 15 October 2000
Word.
MOTOROLA
2-28

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