MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 280

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

8.9 Basic Power Structure
8.9.1 Clock Unit Power Supply
8.9.2 Chip Power Structure
8.9.2.1 VDDL
8.9.2.2 VDDI
MPC555
USER’S MANUAL
KAPWR and VSS power the following clock unit modules: oscillator, PITRTCLK and
TMBCLK generation logic, timebase, decrementer, RTC, PIT, system clock control
register (SCCR), low-power and reset-control register (PLPRCR), and reset status
register (RSR). All other circuits are powered by the normal supply pins, VDDI, VDDL,
VDDH and VSS. The power supply for each block is listed in
The following are the relations between different power supplies:
The MPC555 / MPC556 provides a wide range of possibilities for power supply con-
nections.
sic units on the chip.
The I/O buffers and logic are fed by a 3.3-V power supply.
VDDI powers the internal logic of the MPC555 / MPC556, nominally 3.3 V.
• VDDL = VDDI = VDDSYN = VDDF = 3.3 V ±10%
• KAPWR
• VDDSRAM
• VDDSRAM
• VPP
/
MPC556
Figure 8-10
≥
VDDL – 0.3 V, but VPP – VDDL < 4.0 volts
≥
VDDL – 0.2 V (during normal operation)
≥
≥
VDDL – 0.3 V (during normal operation)
1.4 V (during standby operation)
CLKOUT
SPLL (digital),
System low-power control
Internal logic
Clock drivers
SPLL (analog)
Main oscillator
Reset machine
Limp mode mechanism
Register control
SCCR, PLLRCR and RSR
RTC, PIT, TB, and DEC
SRAM,
VDDSRAM detector,
VSRMCR
Freescale Semiconductor, Inc.
For More Information On This Product,
Table 8-7 Clock Unit Power Supply
illustrates the different power supply sources for each of the ba-
CLOCKS AND POWER CONTROL
Circuit
Go to: www.freescale.com
Rev. 15 October 2000
Power Supply
VDDL/VDDI
VDDSRAM
VDDSYN
KAPWR
Table
8-7.
MOTOROLA
8-20