MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 285

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

8.10 VDDSRAM Supply Failure Detection
8.11 Power Up/Down Sequencing
MPC555
USER’S MANUAL
SPR 268, 269,
SPR Number
Address or
284, 285,
SPR 22
Figure 8-12
WR.
A special circuit for VDDSRAM supply failure detection is provided. In the case of sup-
ply failure detection, the dedicated sticky bits LVSRS in the VSRMCR register are as-
serted. Software can read or clear these bits. The user should enable the detector and
then clear these bits. If the user reads any of the LVSR bits as one, then a power failure
of VDDSRAM has occurred. The circuit is capable of detecting supply failure below 2.6
V. Also, enable/disable control bit for the VDDSRAM detector may be used to discon-
nect the circuit and save the detector power consumption.
Figure 8-13
during normal operation. Note that for each of the conditions detailing the voltage re-
lationships the absolute bounds of the minimum and maximum voltage supply cannot
be violated, i.e. the value of VDDL cannot fall below 3.0 V or exceed 3.6 V and the
value of VDDH cannot fall below 4.5 V or exceed 5.5 V for normal operation. Further
information detailing the functionality of the VPP signal for flash program and erase is
outlined in
tion during power up sequencing can not be specified prior to evaluation and charac-
/
Write to the key other value
MPC556
(Valid for other registers)
Table 8-8 KAPWR Registers and Key Registers (Continued)
Decrementer
See
for bit descriptions.
Time Base
See
scriptions.
19.9.2 FLASH Program/Erase Voltage
KAPWR Register
illustrates the process of locking or unlocking a register powered by KAP-
Power On Reset
and
Figure 8-12 Keep Alive Register Key State Diagram
3.9.5 Decrementer Register (DEC)
Table 3-11
Figure 8-14
Freescale Semiconductor, Inc.
For More Information On This Product,
and
Register
Table 3-14
CLOCKS AND POWER CONTROL
Go to: www.freescale.com
detail the power-up sequencing for MPC555 / MPC556
Rev. 15 October 2000
for bit de-
Locked
Open
0x2F C30C
Address
Conditioning. Power consump-
Time Base and Decrementer Key (TBK)
Associated Key Register
Write to the Key 0x55CCAA33
(Valid for RTC, RTSEC,
RTCAL and RTCSC)
Power On Reset
Register
MOTOROLA
8-25