MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 935

IC MCU 32BIT 40MHZ 272-BGA

MPC555LFMZP40

Manufacturer Part Number
MPC555LFMZP40
Description
IC MCU 32BIT 40MHZ 272-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC555LFMZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
101
Program Memory Size
448KB (448K x 8)
Program Memory Type
FLASH
Ram Size
26K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
272-PBGA
Controller Family/series
POWER 5xx
Ram Memory Size
26KB
Cpu Speed
63MIPS
Embedded Interface Type
QSPI, SCI, TouCAN
Operating Temperature Range
-40°C To +125°C
No. Of Pins
272
Rohs Compliant
No
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
26 KB
Interface Type
CAN, QSPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
101
Operating Supply Voltage
3.3 V to 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPC555CMEE
Minimum Operating Temperature
- 85 C
On-chip Adc
10 bit, 32 Channel
Cpu Family
MPC55xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
40MHz
Total Internal Ram Size
32KB
# I/os (max)
101
Operating Supply Voltage (typ)
5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
272
Package Type
BGA
For Use With
MPC555CMEE - KIT EVAL FOR MPC555
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

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G.18 GPIO Electrical Characteristics
G.19 TPU3 Electrical Characteristics
MPC555 / MPC556
USER’S MANUAL
122
123
Num
Num
124
125 CLKOUT High to TPU Output Channel Hold
126 TPU Input Channel Pulse Width
NOTES:
NOTES:
1. GPIO applies to all pins used as GPIO: SGPIOA[8:31], SQPIOD[0:31], SGPIOC[0:7], QGPIO[0:6], QGPO[1:2],
2. This parameter is tested during initial characterization and is not tested in production.
3. Care should be taken to insure that the total power dissipation of the device remain below the absolute maxi-
1. AC timing is shown with respect to 10% V
2. Timing not valid for external T2CLK input.
3. Care should be taken to insure that the total power dissipation of the device remain below the absolute maxi-
4. t
MPIO[0:15], A_PQA[0:7], B_PQA[0:7], A_PQB[0:7] (inputs only), B_PQB[0:7] (inputs only).
mum rating under this condition. See
user must insure that the pin is always configured as an output and set to slow slew rate mode (SLR0 of PD-
MCR = 0). Do not change SLR0 of PDMCR to a 1 under these conditions.
larger.
mum rating under this condition. See
pin is always configured as an output.
Slew Rate of TPU Output Channel Valid
(SLR0 of PDMCR = 0, 50 pF to 200 pF Load)
(SLR0 of PDMCR = 0, up to 20 nF Load)
(SLR0 of PDMCR = 1, up to 50 pF Load)
cyc
Rise Time
Input
Output
Output
Output (SLR0 of PDMCR = 1), up to 50 pF Load
Fall Time
Input
Output
Output
Output (SLR0 of PDMCR = 1), up to 50 pF Load
is defined as the IMB Clock Period.
2
2
2
2
(SLR0 of PDMCR = 0), 50 pF to 200 pF Load
(SLR0 of PDMCR = 0), 50 pF to 200 pF Load
(SLR0 of PDMCR = 0), up to 20 nF Load
(SLR0 of PDMCR = 0), up to 20 nF Load
Freescale Semiconductor, Inc.
For More Information On This Product,
ELECTRICAL CHARACTERISTICS
Rating
Rating
4
Table G-18 GPIO Timing
Table G-19 TPU3 Timing
Go to: www.freescale.com
Table
Table
Rev. 15 October 2000
1,2
3
DDH
(T
(T
G-1. With a capacitive load > 20 nF (up to 100 nF maximum), the
G-1. With a capacitive load > 20 nF, the user must insure that the
A
A
= T
= T
and 90% V
3
3
L
L
to T
to T
H
H
)
)
DDH
levels. Total slew rate from 0 to V
1
Symbol
Symbol
t
t
CHTOV
CHTOH
t
TIPW
t
t
t
t
ro
fo
ri
fi
2000
2000
2000
Min
Min
90
90
92
3
3
3
0
4
7550
7500
7500
Max
Max
MOTOROLA
600
600
650
25
25
25
15
1
1
DDH
will be
Unit
Unit
t
G-57
µs
ns
ns
ns
µs
ns
ns
ns
ns
ns
cyc

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