MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 889

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

MPC555 / MPC556
USER’S MANUAL
6. 90 pF maximum for mask sets prior to K62N
7. All bus pins support two drive strengths capabilities, 25 pF and 50 pF. Current drive is less at the 25-pF capac-
8. Only IRQ, TPU, MIOS, GPIO, QADC (when digital inputs) and RESET pins have hysteresis, thus there is no
9. The worst case V
10. Maximum occurs during programming and erase. Read I
11. All power consumption characteristics assume 50-pF loads and running a typical application.The power con-
12. Current measured at maximum system clock frequency with QADC active.
13. This parameter is periodically sampled rather than 100% tested.
14. KAPWR and V
15. To obtain full-range results, V
16. To obtain full-range results, V
17. The voltage at which the LVSRS bits in the VSRMCR register will be set ranges from 1.5 – 2.4 V.
18. All injection current is transferred to the V
19. Total injection current for all digital input-only and all digital input/output pins must not exceed 10 mA. Exceed-
20. Below disruptive current conditions, the channel being stressed has conversion values of 0x3FF for analog
itive load. Both modes achieve 40-MHz timing.
hysteresis characteristic required for all other pins
sumption of some modules could go up is they are exercised heavier, but the power consumption of other mod-
ules would decrease.
the power supply within the specified voltage range.
ing this limit can cause disruption of normal operation.
inputs greater than V
to the presence of the sample amplifier. Other channels are not affected by non-disruptive conditions.
DDSRAM
DDF
RH
occurs during HRESET active (booting), other modules will not be running.
Freescale Semiconductor, Inc.
and $000 for values less than V
are powered up prior to any other supply.
For More Information On This Product,
ELECTRICAL CHARACTERISTICS
SSA
SSA
≤ V
≤ V
Go to: www.freescale.com
Rev. 15 October 2000
RL
RL
≤ V
≤ V
DDH
INDC
INDC
. An external load is required to dissipate this current to maintain
≤ V
≤ V
RH
RH
RL
≤ V
≤ V
. This assumes that V
PP
DDA
DDA
is lower.
RH
≤ V
DDA
and V
RL
MOTOROLA
≥ V
SSA
G-11
due