MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 797

IC MCU 32BIT 40MHZ 272-BGA

MPC555LFMZP40

Manufacturer Part Number
MPC555LFMZP40
Description
IC MCU 32BIT 40MHZ 272-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC555LFMZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
101
Program Memory Size
448KB (448K x 8)
Program Memory Type
FLASH
Ram Size
26K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
272-PBGA
Controller Family/series
POWER 5xx
Ram Memory Size
26KB
Cpu Speed
63MIPS
Embedded Interface Type
QSPI, SCI, TouCAN
Operating Temperature Range
-40°C To +125°C
No. Of Pins
272
Rohs Compliant
No
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
26 KB
Interface Type
CAN, QSPI, SCI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
101
Operating Supply Voltage
3.3 V to 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPC555CMEE
Minimum Operating Temperature
- 85 C
On-chip Adc
10 bit, 32 Channel
Cpu Family
MPC55xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
40MHz
Total Internal Ram Size
32KB
# I/os (max)
101
Operating Supply Voltage (typ)
5V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
272
Package Type
BGA
For Use With
MPC555CMEE - KIT EVAL FOR MPC555
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

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MPC555 / MPC556
USER’S MANUAL
0x30 6104 —
0x30 6106
MBISM (MIOS Bus Interface Submodule)
0x30 6800
0x30 6802
0x30 6804
0x30 6806
0x30 6808 –
0x30 680E
MCPSM (MIOS Counter Prescaler Submodule)
0x30 6810 –
0x30 6814
0x30 6816
MIRSM0 (MIOS Interrupt Request Submodule 0)
0x30 6C00
0x30 6C02
0x30 6C04
0x30 6C06
MIRSM (MIOS Interrupt Request Submodule)
0x30 6C30
MIRSM1 (MIOS Interrupt Request Submodule 1)
0x30 6C40
0x30 6C42
0x30 6C44
0x30 6C46
MIRSM (MIOS Interrupt Request Submodule)
0x30 6C70
NOTES:
Address
1. Bit 0 (TEST) is reserved for factory testing.
Table A-10 MIOS1 (Modular Input/Output Subsystem) (Continued)
read only
read only
read only
Access
S/U
S
S,
S,
S,
S
S
S
S
S
S
S
S
S
S
S
S
S
1
MIOS1TPCR
MIOS1VNR
MIOS1MCR
MCPSMSCR
MIOS1SR0
MIOS1ER0
MIOS1RPR0
MIOS1LVL0
MIOS1SR1
MIOS1ER1
MIOS1RPR1
MIOS1LVL1
Freescale Semiconductor, Inc.
MPC555 / MPC556 INTERNAL MEMORY MAP
For More Information On This Product,
Symbol
Go to: www.freescale.com
Rev. 15 October 2000
Reserved
MIOS1 Test and Pin Control Register.
See
Reserved
MIOS1 Module Version Number Register.
See
MIOS1 Module Control Register.
See
Reserved
Reserved
MCPSM Status/Control Register.
See
MIRSM0 Interrupt Status Register.
See
Reserved
MIRSM0 Interrupt Enable Register.
See
MIRSM0 Request Pending Register.
See
MIOS1 Interrupt Level Register 0.
See
MIRSM1 Interrupt Status Register.
See
Reserved
MIRSM1 Interrupt Enable Register.
See
MIRSM1 Request Pending Register.
See
MIOS1 Interrupt Level Register 1.
See
Table 15-3
Table 15-4
Table 15-4
Table 15-10
Table 15-29
Table 15-30
Table 15-31
Table 15-7
Table 15-33
Table 15-34
Table 15-35
Table 15-8
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
for bit descriptions.
Register
Size
16
16
16
16
16
16
16
16
16
16
16
16
MOTOROLA
Reset
S
X
S
S
S
X
S
S
S
X
S
S
S
A-21

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