MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 64

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

2.2 Pin Functionality
MPC555
USER’S MANUAL
NOTES:
1. “/” implies that the corresponding functions are multiplexed on the pin
2. All inputs are 5 V friendly. All 5 V outputs are slow slew rate except for SCI transmit pins.
3. These pins are powered by KAPWR (Keep Alive Power Supply).
The pad ring supports 234 functional pins (284 including all power and ground). Some
pins serve multiple functions. The pad characteristics for each pin are described in
ble
Table 2-1 MPC555 / MPC556 Pin Functions for 272-Pin PBGA (Continued)
Programming Voltage
High voltage Supply
Functional Group
• Pin – List of functional (signal) names for each pin. (For actual pin names, see
• Function – Name of function (signal). Each pin supports one or more functions,
• Driver Type – Type of driver that is used to drive the pin (for output functionality).
• Receiver Type – Type of receiver used for the pin. Some inputs need to have a
• Direction – Direction of the pin for each function it supports. The possible direc-
• Voltage – Voltage requirement for each function of a pin. There are two supply
• Slew rate – Timing needed from the 5-V drivers. The options are with slew rate
• Drive strength – Drive strength for 3-V drivers of the output load. For all 3-V out-
• Pad Type – Functional pad structure used for a pin. For pad type descriptions,
2-2. This table contains the following columns:
/
Pin Names and
and each function (signal) name is a separate entry in the table.
Types of output drivers are:
synchronizer to prevent latching a metastable signal at the pins. Such require-
ments are indicated in this column with the abbreviation “synch.” Another possible
entry is “glitch filter.” It is added to reset signals.
tions are input (I), output (O) and bi-directional (I/O).
voltages: 5 V and 3 V.
(typically 200/50 ns with 50 pF load) or fast 5-V driver.
puts, the drive strength is 25/50 pF. For two pads (clkout and engclk) the drive
strength is 45/90 pF.
see
— Totem pole (TP). This driver type uses a push pull scheme to drive the pin.
— Open drain (OD). This driver type uses an open drain approach to drive the
— Active negated (ANG). This driver type fully drives a low level. A high level is
MPC556
These pins can be driven high or low or can be three-stated. Care must be tak-
en to ensure that there is no contention on this pin (for example, an external
driver driving the pin high while an internal driver is driving it low).
pins. Pins with an OD driver can be either driven low or three-stated. This driver
scheme is typically used for pins that could potentially be asserted by multiple
modules.
driven and then released. A pull-up resistor may be needed on this type of out-
put.
2.5 Pad
Types.
Freescale Semiconductor, Inc.
Abbreviations.
For More Information On This Product,
Go to: www.freescale.com
SIGNAL DESCRIPTIONS
Rev. 15 October 2000
VDDH, VDDA, VRH
Signals
VPP
1
Pins
12
1
MOTOROLA
3 V / 5 V
3-V / 5-V
5 V
Ta-
2
2.7
2-6