MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 268

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

MPC555
USER’S MANUAL
GCLK2. When DFNH = 0, GCLK2_50 has a 50% duty cycle. With other values of
DFNH or DFNL, the duty cycle is less than 50%. Refer to
simultaneously with GCLK1. When the MPC555 / MPC556 is not in gear mode, the
falling edge of GCLK1_50 occurs in the middle of the high phase of GCLK2_50. EBDF
determines the division factor between GCLK1/GCLK2 and GCLK1_50/GCLK2_50.
During power-on reset, the MOCCK1, MODCK2, and MODCK3 pins determine the
clock source for the PLL and the clock drivers. These pins are latched on the positive
edge of PORESET. Their values must be stable as long as this line is asserted. The
configuration modes are shown in
the SPLL (OSCM or EXTCLK). MODCK1, MODCK2, and MODCK3 together deter-
mine the multiplication factor at reset and the functionality of limp mode.
If the configuration of PITRTCLK and TMBCLK and the SPLL multiplication factor is to
remain unchanged in power-down low-power mode, the MODCK signals should not
be sampled at wake-up from this mode. In this case the PORESET pin should remain
negated and HRESET should be asserted during the power supply wake-up stage.
When MODCK1 is cleared, the output of the main oscillator (OSCM) is selected as the
input to the SPLL. When MODCK1 is asserted, the external clock input (EXTCLK) is
selected as the input to the SPLL. In all cases, the system clock frequency (freq
can be reduced by the DFNH[0:2] bits in the SCCR. Note that freq
when the DFNH bits are cleared.
The TBS bit in the SCCR selects the time base clock to be either the SPLL input clock
or GCLK2. When the backup clock is functioning as the system clock, the backup clock
is automatically selected as the time base clock source.
The PITRTCLK frequency and source are specified by the RTDIV and RTSEL bits in
the SCCR. When the backup clock is functioning as the system clock, the backup
clock is automatically selected as the time base clock source.
When the PORESET pin is negated (driven to a high value), the MODCK1, MODCK2,
and MODCK3 values are not affected. They remain the same as they were defined
during the most recent power-on reset.
Table 8-1
serted).
/
MPC556
shows the clock configuration modes during power-on reset (PORESET as-
The MODCK[1:3] are shared functions with IRQ[5:7]. If IRQ[5:7] are
used as interrupts, the interrupt source should be removed during
PORESET to insure the MODCK pins are in the correct state on the
rising edge of PORESET.
Freescale Semiconductor, Inc.
For More Information On This Product,
CLOCKS AND POWER CONTROL
Go to: www.freescale.com
Rev. 15 October 2000
Table
NOTE
8-1. MODCK1 specifies the input source to
Figure
8-7. GCLK1_50 rises
gclk2(max)
MOTOROLA
occurs
gclk2
8-8
)