MPC555LFMZP40 Freescale Semiconductor, MPC555LFMZP40 Datasheet - Page 884

• Manufacturer Part Number: MPC555LFMZP40
• Description: IC MCU 32BIT 40MHZ 272-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC555LFMZP40

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 26K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 272-PBGA
• Controller Family/series: POWER 5xx
• Ram Memory Size: 26KB
• Cpu Speed: 63MIPS
• Embedded Interface Type: QSPI, SCI, TouCAN
• Operating Temperature Range: -40°C To +125°C
• No. Of Pins: 272
• Rohs Compliant: No
• Processor Series: MPC5xx
• Core: PowerPC
• Data Bus Width: 32 bit
• Data Ram Size: 26 KB
• Interface Type: CAN, QSPI, SCI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 101
• Operating Supply Voltage: 3.3 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPC555CMEE
• Minimum Operating Temperature: - 85 C
• On-chip Adc: 10 bit, 32 Channel
• Cpu Family: MPC55xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 101
• Operating Supply Voltage (typ): 5V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 272
• Package Type: BGA
• For Use With: MPC555CMEE - KIT EVAL FOR MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

G.6 ESD Protection
MPC555 / MPC556
USER’S MANUAL
ESD Target for Human Body Model (HBM)
HBM Circuit Description
ESD Target for Machine Model (MM)
MM Circuit Description
Number of Pulses Per Pin
Positive Pulses (MM)
Negative Pulses (MM)
Positive Pulses (HBM)
Negative Pulses (HBM)
Interval of Pulses
MIL-SPEC and EIA/JESD (JEDEC) characteristics are available from Global Engi-
neering Documents at 800-854-7179 or 303-397-7956.
JEDEC characteristics are available on the WEB at:
Notes:
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Inte-
2. A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board
grated Circuits.
characteristic requirements. Complete DC parametric and functional testing shall be performed per appli-
cable device characteristic at room temperature followed by hot temperature, unless specified otherwise in
the device characteristic.
Within an Automotive Engine Controller Module,” Proceedings of SemiTherm,
San Diego, 1998, pp. 47-54.
Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of
SemiTherm, San Diego, 1999, pp. 212-220.
Characteristics
Freescale Semiconductor, Inc.
For More Information On This Product,
ELECTRICAL CHARACTERISTICS
Table G-3 ESD Protection
Go to: www.freescale.com
Rev. 15 October 2000
Symbol
R1
R1
—
—
C
C
http://www.jedec.org
Value
2000
1500
100
200
200
0
3
3
1
1
1
Second
MOTOROLA
Units
pF
pF
—
V
Ω
V
Ω
G-6