R5S77631Y266BGV Renesas Electronics America, R5S77631Y266BGV Datasheet - Page 1511

• Manufacturer Part Number: R5S77631Y266BGV
• Description: IC SUPERH MPU ROMLESS 499BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7780r

Specifications of R5S77631Y266BGV

• Core Processor: SH-4A
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: Audio Codec, I²C, MMC, SCI, SIM, SIO, SSI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 107
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.35 V
• Data Converters: A/D 4x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 499-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

1. Philips Format
Figures 34.2 and 34.3 show the supported Philips protocol both with padding and without.
Padding occurs when the data word length is smaller than the system word length.
Figure 34.4 shows the format used by Sony. Figure 34.5 shows the format used by Matsushita.
Padding is assumed in both cases, but may not be present in a final implementation if the
system word length equals the data word length.
SSI_SDATA
SSI_SCK
SSI_WS
SSI_SDATA
SSI_SCK
SSI_WS
SCKP = 0, SWSP = 0, DEL = 0, CHNL = 00, SPDP = 0, SDTA = 0
System word length > data word length
SCKP = 0, SWSP = 0, DEL = 0, CHNL = 00
System word length = data word length
prev. sample MSB
Figure 34.2 Philips Format (with no Padding)
MSB
Figure 34.3 Philips Format (with Padding)
Data word 1
System word 1
System word 1 =
data word 1
LSB
LSB
Padding
1
LSB MSB
MSB
Rev. 2.00 May 22, 2009 Page 1441 of 1982
System word 2 =
data word 2
Data word 2
Section 34 Serial Sound Interface (SSI)
System word 2
LSB
1
LSB
LSB next sample
Padding
REJ09B0256-0200
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