R5S77631Y266BGV Renesas Electronics America, R5S77631Y266BGV Datasheet - Page 2018

• Manufacturer Part Number: R5S77631Y266BGV
• Description: IC SUPERH MPU ROMLESS 499BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7780r

Specifications of R5S77631Y266BGV

• Core Processor: SH-4A
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: Audio Codec, I²C, MMC, SCI, SIM, SIO, SSI, USB
• Peripherals: DMA, LCD, POR, WDT
• Number Of I /o: 107
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.15 V ~ 1.35 V
• Data Converters: A/D 4x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 499-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Appendix
J.2
Table J.1 shows the analysis results of heat resistance simulation. As shown, Tj exceeds 125°C
when Ta = 75°C and a heat sink is not provided. Therefore, if Ta possibly exceeds 60°C, heat
radiation measures are indispensable.
Table J.1
Note: Tj and θja vary depending on the PCB, casing, heat source, and other environmental
Rev. 2.00 May 22, 2009 Page 1948 of 1982
REJ09B0256-0200
Power Consumption (W) Heat Sink
2.4
2.4
2.4
factors.
Analysis Results of Heat Resistance Simulation
Heat Resistance Simulation Results
Casing
Figure J.1 Overall View of Simulation Model (with heat sink)
Not provided
Provided
Not provided
Ta (°C)
75
75
60
Heat sink
This LSI
Tj (°C)
136.9
116.9
122.9
PCB
17.4
θja (°C/W)
25.8
26.2