LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet - Page 184

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LPC1837FET256,551

Manufacturer Part Number
LPC1837FET256,551
Description
Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
Manufacturer
NXP Semiconductors
Series
LPC18xxr

Specifications of LPC1837FET256,551

Core
ARM Cortex M3
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
 Details
Other names
935293795551
NXP Semiconductors
[10] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide
[11] 5 V tolerant pad with 20 ns glitch filter; provides digital I/O functions with open-drain output with weak pull-up resistor and hysteresis.
[12] For the LQFP144 package, VSSIO and VSS are connected to a common ground plane.
<Document ID>
User manual
output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
All information provided in this document is subject to legal disclaimers.
Rev. 00.13 — 20 July 2011
Chapter 12: LPC18xx Pin configuration
UM10430
© NXP B.V. 2011. All rights reserved.
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