LPC1837FET256,551 NXP Semiconductors, LPC1837FET256,551 Datasheet - Page 5

• Manufacturer Part Number: LPC1837FET256,551
• Description: Microcontrollers (MCU) 32BIT ARM CORTEX-M3 MCU 136KB SRAM
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1837FET256,551

• Core: ARM Cortex M3
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 136K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Details
• Other names: 935293795551

NXP Semiconductors
<Document ID>
User manual
•
•
•
– Two 32 kB SRAM blocks with separate bus access. Both SRAM blocks can be
– 64 kB ROM containing boot code and on-chip software drivers.
– 32-bit One-Time Programmable (OTP) memory for general-purpose customer use.
On-chip memory (parts with on-chip flash)
– Up to 1 MB total dual bank flash memory with flash accelerator.
– In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
– Up to 136 kB SRAM for code and data use.
– Two 32 kB SRAM blocks with separate bus access. Both SRAM blocks can be
– 32 kB ROM containing boot code and on-chip software drivers.
– 32-bit One-Time Programmable (OTP) memory for general-purpose customer use.
Clock generation unit
– Crystal oscillator with an operating range of 1 MHz to 25 MHz.
– 12 MHz internal RC oscillator trimmed to 1 % accuracy.
– Ultra-low power RTC crystal oscillator.
– Three PLLs allow CPU operation up to the maximum CPU rate without the need for
– Clock output.
Serial interfaces:
– Quad SPI Flash Interface (SPIFI) with four lanes and data rates of up to 40 MB per
– 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high
– One High-speed USB 2.0 Host/Device/OTG interface with DMA support and
– One High-speed USB 2.0 Host/Device interface with DMA support, on-chip
– USB interface electrical test software included in ROM USB stack.
– Four 550 UARTs with DMA support: one UART with full modem interface; one
– Two C_CAN 2.0B controllers with one channel each.
– Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA
– One Fast-mode Plus I
– One standard I
powered down individually.
bootloader software.
powered down individually.
a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the
third PLL can be used as audio PLL.
second total.
throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time
stamping (IEEE 1588-2008 v2).
on-chip PHY.
full-speed PHY and ULPI interface to external high-speed PHY.
UART with IrDA interface; three USARTs support synchronous mode and a smart
card interface conforming to ISO7816 specification.
support.
pins conforming to the full I
1 Mbit/s.
All information provided in this document is subject to legal disclaimers.
2
Rev. 00.13 — 20 July 2011
C-bus interface with monitor mode and standard I/O pins.
2
C-bus interface with monitor mode and with open-drain I/O
2
C-bus specification. Supports data rates of up to
Chapter 1: Introductory information
UM10430
© NXP B.V. 2011. All rights reserved.
5 of 1164