MPC561MZP56 Freescale, MPC561MZP56 Datasheet - Page 1220

• Manufacturer Part Number: MPC561MZP56
• Manufacturer: Freescale

Specifications of MPC561MZP56

• Cpu Family: MPC56x
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 56MHz
• Interface Type: QSPI/SCI/SPI/UART
• Total Internal Ram Size: 32KB
• # I/os (max): 56
• Number Of Timers - General Purpose: 22
• Operating Supply Voltage (typ): 2.6/5V
• Operating Supply Voltage (max): 2.7/5.25V
• Operating Supply Voltage (min): 2.5/4.75V
• On-chip Adc: 2(32-chx10-bit)
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 388
• Package Type: BGA
• Program Memory Type: ROMLess
• Program Memory Size: Not Required
• Lead Free Status / RoHS Status: Not Compliant

Electrical Characteristics
An estimation of the chip junction temperature, T
where:
The junction to ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. Unfortunately, the answer is only an estimate; test cases have
demonstrated that errors of a factor of two are possible. As a result, more detailed thermal characterization
is supplied.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
where:
R
case to ambient thermal resistance, R
a heat sink, change the mounting arrangement on printed circuit board, or change the thermal dissipation
on the printed circuit board surrounding the device. This description is most useful for ceramic packages
with heat sinks where about 90% of the heat flow is through the case to the heat sink to ambient. For most
packages, a better model is required.
The simplest thermal model of a package which has demonstrated reasonable accuracy (about 20 percent)
is a two resistor model consisting of a junction to board and a junction to case thermal resistance. The
junction to case covers the situation where a heat sink will be used or where a substantial amount of heat
is dissipated from the top of the package. The junction to board thermal resistance describes the thermal
performance when most of the heat is conducted to the printed circuit board. It has been observed that the
thermal performance of most plastic packages and especially PBGA packages is strongly dependent on the
board. temperature.
If the board temperature is known, an estimate of the junction temperature in the environment can be made
using the following equation:
where:
F-4
θJC
is device related and cannot be influenced. The user controls the thermal environment to change the
T
T
R
P
R
R
R
R
T
T
R
P
A
D
D
J
J
B
θJA
θJA
θJA
θJC
θJA
θJB
= T
= T
= ambient temperature (°C)
= power dissipation in package
= board temperature (°C)
= power dissipation in package (
= junction to case thermal resistance (°C/W)
= package junction to board resistance (°C/W)
= package junction to ambient resistance (°C/W)
= R
= junction to ambient thermal resistance (°C/W)
= case to ambient thermal resistance (°C/W)
A
B
+ (R
+ (R
θJC
θJA
+ R
θJB
θCA
x P
x P
D
D
)
)
MPC561/MPC563 Reference Manual, Rev. 1.2
θCA
. For instance, the air flow can be changed around the device, add
Ω
)
J
, in °C can be obtained from the equation:
Freescale Semiconductor